Hermetic Packaging Market : Rising Demand of Hermetically Packaged Components and Ics for Myriad Applications

"Hermetic Packaging Market by Configuration (Multilayer Ceramic Packages, Metal Can Packages, Pressed Ceramic Packages), Type (Ceramic-Metal Sealing, Glass-Metal Sealing), Application, Industry, and Geography - Global Forecast to 2023", the overall hermetic packaging market is estimated at USD 3.25 Billion in 2018 and is expected to reach USD 4.52 Billion by 2023, growing at a CAGR of 6.80% between 2018 and 2023. The major factors driving the growth of the hermetic technology market include rising adoption of hermetic packaging for protecting highly sensitive electronic components and growing demand from industries such as automobile electronics and aerospace.

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Browse 66 tables and 47 figures spread through 156 pages and in-depth TOC on "Hermetic Packaging Market - Global Forecast to 2023"

·         Multilayer ceramic packages are expected to lead the global hermetic packaging market between 2018 and 2023

·         The aeronautics and space industry is expected to grow at the highest rate between 2018 and 2023

·         The hermetic packaging market in APAC expected to capture the largest market share during the forecast period

The present market is dominated by the players such as SCHOTT AG (Germany), Teledyne Microelectronics (US), AMETEK. (US), Texas Instruments (US), and Amkor Technology (US). Know sample pages of report : https://www.marketsandmarkets.com/requestsampleNew.asp?id=18037377

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