According to the new market research report "System in Package Market
by Packaging Technology (2D IC, 2.5D IC, 3D IC), Package Type (BGA,
SOP), Packaging Method (Flip Chip, Wire Bond), Device (RF Front-End, RF
Amplifier), Application (Consumer Electronics, Communications) - Global
Forecast to 2023", the system in package market is expected to
grow from USD 5.79 Billion in 2017 to USD 9.07 Billion by 2023, at a
CAGR of 9.4%. The factors that are driving the growth of this market are
the growing demand for miniaturization of electronics devices, the
impact of Internet of Things (IoT), and reduced time-to-market.
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Browse 56 market data tables, 52 figures spread through 154 pages and in-depth TOC on “System in Package Market”
ASE
Group (Taiwan), Amkor Technology (US), JCET (China), Chipmos
Technologies (Taiwan), Chipbond Technology (Taiwan), KYEC (Taiwan),
Intel (US), Samsung Electronics (South Korea), Texas Instruments (US),
and Signetics (South Korea) are the major players operating in the
system in package market.
By package method, the fan-out wafer level packaging segment is expected to grow at the highest growth rate during the forecast period
By package method, the fan-out wafer level packaging segment is expected to grow at the highest growth rate during the forecast period
The
system in package market based on packaging method has been segmented
into flip chip (FC), wire bond and die attach (WB and DA), and fan-out
wafer level packaging (FOWLP). Intel (US) was the early adopter of flip
chip packaging method for packaging of its mainstream CPUs to improve
the electrical and thermal performance of the processors. The increasing
need for functionalities and reduced package sizes led to the
integration of flip chip packaging method in baseband and application
processors for mobile platforms. However, FOWLP is a key packaging
method used while embedding heterogeneous devices such as baseband
processors, RF transceivers, and power management ICs (PMICs). Moreover,
the increasing demand for a large number of I/O points for
semiconductor devices is expected to generate the demand for FOWLP
packaging method.
By device, the RF front-end device holds the largest share of the market
By device, the RF front-end device holds the largest share of the market
The
system in package market for RF front-end packaging method held the
largest size in 2016. The rising demand for compact size and high
frequency transceivers solutions, in products such as smartphones and
tablets, is expected to drive the growth of RF front-end devices.
APAC to account for the largest market size during the forecast period.
APAC to account for the largest market size during the forecast period.
The
APAC region is expected to hold the largest share of the SiP market
during the forecast period. The demand for the SiP technology is more
from the consumer electronics sector, particularly for smartphones and
tablets. As a result, the presence of big companies in this sector, such
as Samsung Electronics (South Korea) and Sony (Japan), is driving the
system in package market in APAC.
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