Sunday, 23 February 2020

Hermetic Packaging Market : Rising Demand of Hermetically Sealed Packaging Components and Ics for Myriad Applications

"Hermetic Packaging Market by Configuration (Multilayer Ceramic Packages, Metal Can Packages, Pressed Ceramic Packages), Type (Ceramic-Metal Sealing, Glass-Metal Sealing), Application, Industry, and Geography - Global Forecast to 2023", the overall hermetic packaging market is estimated at USD 3.25 Billion in 2018 and is expected to reach USD 4.52 Billion by 2023, growing at a CAGR of 6.80% between 2018 and 2023. The major factors driving the growth of the hermetic technology market include rising adoption of hermetic packaging for protecting highly sensitive electronic components and growing demand from industries such as automobile electronics and aerospace.

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Every hermetically packaged electronic component or device used in the military & defense industry needs to meet the US military standards such as method 1014.13 of MIL-STD-883, method 1071 of MIL-STD-750, and appendix C of MIL-PRF-38534G. These standards focus on measurement of the hermeticity of a package and define the acceptable leak rate for hermetic packaging. According to these standards, the moisture level of 5,000 parts per million (ppm) at 100°C is acceptable for packages of internal volume smaller than 10 mm3 as well as a leak rate of ≤510−9cm3s−1 of dry air at 25°C.

Microelectronic components used in aerospace, military, and medical devices have the toughest regulation for hermetic packaging primarily because of their life-critical applications. Tightening of standards compels companies buying new leak test equipment as older ones no longer have the required test sensitivity to test according to the new standards. Market players need to adhere to such standards to increase their market share at the expense of increased expenditure. These stringent standards for hermetic packaging restrain the growth of the concern market.

Browse 66 tables and 47 figures spread through 156 pages and in-depth TOC on "Hermetic Packaging Market - Global Forecast to 2023"

- Multilayer ceramic packages are expected to lead the global hermetic packaging market between 2018 and 2023

- The aeronautics and space industry is expected to grow at the highest rate between 2018 and 2023

- The hermetic packaging market in APAC expected to capture the largest market share during the forecast period

The present market is dominated by the players such as SCHOTT AG (Germany), Teledyne Microelectronics (US), AMETEK. (US), Texas Instruments (US), and Amkor Technology (US).
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