According
to the new market research report "IO-Link Market by Component
(IO-Link Masters and IO-Link Devices), Application (Machine Tool, Handling
& Assembly Automation, Packaging, Intralogistics), Industry (Discrete,
Hybrid, and Process), and Geography - Global Forecast to 2023", The
IO-Link market is expected to reach USD 12.20 billion by 2023 from USD 2.87
billion in 2018, at a CAGR of 33.56%. The growth of the IO-Link market can be
attributed to the initiatives of governments across the world toward the
adoption of industrial automation; high focus on increasing energy efficiency,
optimizing resources, and reducing production costs; and rise of digital
industrial technology Industry 4.0. Moreover, the release of IO-Link safety
specification in 2017 and availability of cloud interface in IO-Link are likely
to create huge growth opportunities for players in the market.
Browse 78
market data Tables and 41 Figures spread through 142 Pages and
in-depth TOC on IO-Link
Market
IO-Link market for packaging applications to grow at highest rate during forecast period
IO-Link market for packaging applications to grow at highest rate during forecast period
The
increased focus by many manufacturing industries to ensure greater operating
safety and efficiency, as well as reduce errors and improve working conditions,
has aided the adoption of the packaging automation solutions in industries. The
packaging application is expected to exhibit the highest growth in the IO-Link
market owing to the flexibility that IO-Link provides to fulfil the
requirements for optimizing the packaging process.
•
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IO-Link
market for discrete industries to register largest shipment in 2018
The
IO-Link technology has gained popularity in discrete industries mainly due to
the recent surge in the adoption of Ethernet communication protocol in
automotive, medical devices, and semiconductor and electronics industries. Due
to the high cost and design complexity, the Ethernet communication protocol is
not suitable for field-level communication applications wherein many sensors
and actuators are used. This limitation of Ethernet has provided new growth
opportunity to IO-Link to be adopted as a field-level communication protocol in
recent years. Moreover, the Ethernet protocol is expected to account for a
major market share for discrete industries during the forecast period. This, in
turn, is expected to boost the IO-Link market growth in discrete industries in
the coming years.
APAC
to hold largest size of IO-Link market by 2023
Growing
manufacturing sector in APAC countries such as China, Japan, and South Korea is
expected to contribute to the growth of the IO-Link market in this region
during the forecast period. China is a global manufacturing hub for
semiconductor and automotive manufacturers. Rapidly growing automotive industry
in China is likely to create growth opportunities for the IO-Link market
players in this country. With the growing automotive and manufacturing
industries, China witnessed a significant increase in the adoption of IO-Link
in the last couple of years.
•
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Major
players in the IO-Link market covered in this report are Siemens (Germany),
Balluff (Germany), Ifm electronic (Germany), SICK (Germany), Rockwell
Automation (US), Festo (Germany) Omron (Japan), Banner Engineering (US), Hans
Turck (Germany), Pepperl & Fuchs (Germany), and Datalogic (Italy).
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