Structured Cabling Market worth $13.13 Billion by 2020

According to a new market research report "Structured Cabling Market by Solution Type (Products, Services and Software), Vertical (IT & Telecommunication, Residential & Commercial, Government & Education, Transportation, Industrial and Others) and geography - Global forecast to 2020", the global structured cabling market was valued at $7.72 Billion in 2014 and is expected to reach up to $13.13 Billion by 2020, at a CAGR of 9.0% between 2015 and 2020.

• Download Informational PDF Brochure :-
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Browse 69 tables and 92 figures spread through 179 Pages and in-depth TOC on "Structured Cabling Market - Global forecast to 2020"
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Early buyers will receive 10% customization on reports.

Structured cabling system can be defined as a set of cables & connectivity products that are used for the integration of various management systems to enable the transmission of voice, data, and video signals. The structured cabling market has faced its highs and lows, however has managed to register a healthy growth rate. This market is expected to witness moderate growth during the forecast period. The demand for high-speed connectivity devices & systems, trend of data center convergence, and expansion of the communication infrastructure are some of the primary factors that are contributing to the growth of this market. The extensive growth of LED lighting systems market, transition from analog to IP-based video surveillance systems, and increasing usage of FTTH/FTTP are expected to drive the market in the future.

This report provides a detailed analysis of the overall structured cabling market and segments the same based on component, application, vertical, and geography.

The objective of the research study was to analyze the market trends for each of the industries, the growth rates of the various solution types, and the demand comparison for all industry verticals. The structured cabling market has been segmented based on solution type into products, services, and software which are the crucial components of a structured cabling system which is formed by the integration of various management systems to combine the voice, data, and video signals.

Apart from the market segmentation, the report also covers the Porter’s Five Forces analysis, the market’s value chain with a detailed process flow diagram, and the market dynamics such as the drivers, restraints, and opportunities in the overall structured cabling market.

The major players in the structured cabling market have also been profiled in this report. The company profile section covers the profiles of the top 10 players in this market. It provides information about their business overview along with products & services offered, key strategies and recent developments, and the MnM view for the profiled companies.

This report profiles all the major companies involved in the structured cabling market such as CommScope, Inc. (U.S.), Nexans S.A. (France), Panduit Corp. (U.S.), Legrand (France), Corning, Inc. (U.S.), Belden, Inc. (U.S.), ABB Ltd. (Switzerland), Schneider Electric SE (France), Panduit Corp. (U.S.), and Siemon (U.S.).

About MarketsandMarkets

MarketsandMarkets is world’s No. 2 firm in terms of annually published premium market research reports. Serving 1700 global fortune enterprises with more than 1200 premium studies in a year, M&M is catering to multitude of clients across 8 different industrial verticals. We specialize in consulting assignments and business research across high growth markets, cutting edge technologies and newer applications. Our 850 fulltime analyst and SMEs at MarketsandMarkets are tracking global high growth markets following the "Growth Engagement Model – GEM". The GEM aims at proactive collaboration with the clients to identify new opportunities, identify most important customers, write "Attack, avoid and defend" strategies, identify sources of incremental revenues for both the company and its competitors.

M&M’s flagship competitive intelligence and market research platform, "RT" connects over 200,000 markets and entire value chains for deeper understanding of the unmet insights along with market sizing and forecasts of niche markets. The new included chapters on Methodology and Benchmarking presented with high quality analytical infographics in our reports gives complete visibility of how the numbers have been arrived and defend the accuracy of the numbers.

We at MarketsandMarkets are inspired to help our clients grow by providing apt business insight with our huge market intelligence repository.

Contact:
Mr. Rohan
Markets and Markets
UNIT no 802, Tower no. 7, SEZ
Magarpatta city, Hadapsar
Pune, Maharashtra 411013, India
1-888-600-6441
Email: sales@marketsandmarkets.com

System in Package (SiP) Market worth $18.10 Billion by 2020

According to a new market research report "System in Package (SIP) Market by Technology (2D, 2.5D & 3D), by Type (BGA, SMT, QFP, SOP), Interconnection Technology (Flip-Chip & Wire-bond), Applications (Communications, Consumer, Automotive, Medical) and Geography (N. America, Europe, APAC & ROW) Global Trends & Forecasts to - 2014 - 2020" the total System in Package (SiP) market is expected to reach $18.10 billion by 2020, growing at a CAGR of 9.57% from 2013 to 2020.

• Download Informational PDF Brochure :-
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Browse 76 market data tables, 59 figures spread through 277 pages and in-depth TOC on “System in Package (SIP) Market by Technology (2D, 2.5D & 3D), by Type (BGA, SMT, QFP, SOP), Interconnection Technology (Flip-Chip & Wire-bond), Applications (Communications, Consumer, Automotive, Medical) and Geography (N. America, Europe, APAC & ROW) Global Trends & Forecasts to - 2014 - 2020”
http://www.marketsandmarkets.com/Market-Reports/System-In-Package-SIP-Market-Chip-Stack-Multi-Chip-Module-MCM-Market-625.html
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The advance packaging has given a rise to innovative safety systems in automotive and transportation sector which will drive the System in Package (SiP) market; for example, Local Interconnect Network (LIN) solutions within the vehicle for operating the devices was introduced by Atmel Corporation (U.S.). In the overall System in Package (SiP) market, the consumer electronics sector will be the highest revenue generator and lead the market from the demand side. Semiconductor industry has a trend of outsourcing advance packaging and testing services, in which, most of the players are from the Asia-Pacific region.

The concept of System in Package (SiP) came into major attention when increasing demands for miniaturization and higher functionality at lower cost process was introduced by advance semiconductor packaging industries. As the ICs and the major electrical component were packaged into a single module, this had increased the overall performance, reliability, and efficiency of the module.

The report’s detailed segmentations by technology, packaging type, interconnection technology, applications, and geography cover all the existing and emerging technologies in the System in Package (SiP) market. The major packaging technologies that have been extensively covered in the report are 2D, 2.5D, and 3D IC packaging; the packaging types covered are Ball Grid Array (BGA), Surface Mount Technology (SMT), Quad Flat Package (QFP), and Small Outline Package (SOP); and the interconnection technologies for packaging are flip chip and wire bond technologies.

The application segmentation of the market covers all the major applications like consumer electronics, communication, medical, industrial, automobile and transportation, and military, defense, and aerospace in detail.

One of the objectives of the research study was to analyze the market trends for each of the System in Package (SiP) technologies; and the growth rates of the various packaging type and interconnection technologies.

Apart from market segmentation, the report also includes in depth analysis like the Porter’s five force analysis, value chain with detailed process flow diagram, and market dynamics such as drivers, restraints, and opportunities for the overall System in Package (SiP) market.

About MarketsandMarkets

MarketsandMarkets is a global market research and consulting company based in the U.S. We publish strategically analyzed market research reports and serve as a business intelligence partner to Fortune 500 companies across the world.

MarketsandMarkets also provides multi-client reports, company profiles, databases, and custom research services. M&M covers thirteen industry verticals, including advanced materials, automotives and transportation, banking and financial services, biotechnology, chemicals, consumer goods, energy and power, food and beverages, industrial automation, medical devices, pharmaceuticals, semiconductor and electronics, and telecommunications and IT.

We at MarketsandMarkets are inspired to help our clients grow by providing apt business insight with our huge market intelligence repository. 

Contact:
Mr. Rohan
North - Dominion Plaza,
17304 Preston Road,
Suite 800, Dallas, TX 75252
Tel: +1-888-600-6441
Email: sales@marketsandmarkets.com

Supercapacitor Market worth 2.18 Billion USD by 2022

Supercapacitor Market worth 2.18 Billion USD by 2022

According to the new report “Supercapacitor Market by Type (Double Layer, Pseudocapacitor, and Hybrid), Application (Laptop, Camera, Power Backup, Memory, UPS, Aircraft, Solid-State Disc Drives) Vertical, and Geography — Global Forecast to 2022”, the supercapacitor market is estimated to be valued at USD 568.2 million in 2015 and is expected to reach USD 2,181.2 Million by 2022 at a CAGR of 20.7 % between 2016 and 2022. Factors such as high storage capabilities, need of power conservation, high performance supercapacitors for consumer and automotive applications, and additional capabilities such as moisture resistant, light weight and low equivalent series resistance are the key drivers for supercapacitor market.

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Browse 74 market data tables and 58 figures spread through 162 pages and in-depth TOC on “Supercapacitor Market — Global Forecast to 2022”
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Double layer capacitor held the largest market share in 2015 and is expected to exhibit high growth during the forecast period

Double layer capacitor is the major contributor of this market. The market for double layer capacitors is increasing rapidly. Its applications vary from portable electronics and medical devices to hefty hybrid and other transportation uses. Moreover, supercapacitor can also be used in other application such as memory, power backup, led signs, and renewable energy.

Automotive vertical expected to grow at the highest rate during the forecast period

Supercapacitors have extensive range of uses in automotive. The significance of supercapacitor is increasing owing to the growing implementation of automobiles that uses electrical systems to become more energy efficient. Battery uses more energy by losing kinetic energy while accelerating and decelerating the vehicle Thus, supercapacitors helps reduce energy usage for power break application in automotive industry use of traditional batteries in the automotive sector. The supercapacitors are used widely in the automotive for headlights, the climate control, and audio system.

APAC held the largest share of the supercapacitor market

The major tech companies such as Panasonic Corporation (Japan), Murata Manufacturing Co., Ltd. (Japan), and Nesscap Co., Ltd. (China), among others have been responsible for the dynamic growth of the supercapacitor market in APAC. China held the largest market share in APAC, in 2015. Additionally, its application in the consumer electronics and automotive vertical has fueled the market growth.

The market in APAC is expected to grow at the highest rate during the forecast period. The increasing number of businesses in APAC has increased the demand for supercapacitor.

Major players operating in the supercapacitor market include Cap-XX Limited (Australia), Panasonic Corporation (Japan), Nesscap Energy Inc. (Canada), Murata Manufacturing Co., Ltd. (Japan), Maxwell Technologies, Inc. (U.S.), Axion Power International, Inc. (U.S.), AVX Corporation (U.S.), Graphene Laboratories, Inc. (U.S.), Nippon Chemi-Con Corporation (Japan), Mouser Electronics, Inc. (U.S.), and Evans Capacitor Company (U.S.).

Pico Projector Market worth 3.44 Billion USD by 2022

According to the new market research report “Pico Projector Market by Type (Embedded, Non-embedded), Technology (DLP, LCoS, LBS), Specification (Brightness, Resolution, Power Source), Application (Consumer Electronics, Business & Education), Components, and Geography — Global Forecast to 2022”, the pico projector market was valued at USD 1.28 Billion in 2015 and is expected to reach USD 3.44 Billion by 2022, at a CAGR of 14.52% between 2016 and 2022. The factors that are driving the growth of the pico projector market include the integration of projection technologies with portable electronic devices and the development of pico projectors with superior specifications.

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Browse 71 market data tables and 68 figures spread through 155 pages and in-depth TOC on “Pico Projector Market — Global Forecast to 2022”
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“Non-embedded (standalone) pico projectors to hold the largest share of the pico projector market“

Non-embedded (standalone) pico projectors would lead the global pico projector market between 2016 and 2022. The growth of the pico projector market is driven by factors, such as ease of connectivity, high resolution output, greater display size, and improved brightness level. Moreover, some other factors such as the small-form and convenience makes the non-embedded (standalone) pico projector popular among end users.

“DLP technology market for pico projector is expected to hold the largest share, whereas LBS technology is expected to grow at the highest rate between 2016 and 2022”

Digital light processing (DLP) is a renowned projection technology pioneered by Texas Instruments, Inc. (U.S.). DLP is one of the best technologies in the field of projection engineering and is also widely adopted in pico projectors. DLP technology is being used in cinema and conventional projector, hence this technology also offers excellent results in the pico projector. Laser beam steering (LBS) is an emerging technology in the field of projection and is patented by MicroVision, Inc. (U.S.). LBS provides focus-free operation, and vivid and clear picture as compared to other technologies at equivalent brightness level.

“Asia-Pacific (APAC) is expected to lead the growth in the pico projector market between 2016 and 2022”

The growth of the pico projector market in APAC is expected owing to the huge demand of pico projectors from consumer electronics, and business and education segment. Moreover, per capita disposable income and economic activities are increasing in APAC. Many emerging companies in APAC are engaging in the development of pico projectors. Furthermore, strategies like new product launches are also driving the growth of the pico projectors in APAC.

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The major players involved in the pico projector market, include Aaxa Technologies, Inc. (U.S.), LG Electronics, Inc. (South Korea), Koninklijke Philips N.V. (Netherlands), Sony Corporation (Japan), Lenovo Group Ltd. (China), along with other emerging companies, such as RIF6, LLC (U.S.), Cremotech Co., Ltd. (Taiwan), and Celluon, Inc. (South Korea). Texas Instruments, Inc. (U.S.) and MicroVision, Inc. (U.S.) are considered as the key suppliers of the projection technology in the pico projector market.

Ballast Water Treatment Market worth 118.77 Billion USD by 2022

Ballast Water Treatment Market worth 118.77 Billion USD by 2022

According to the new market research report “Ballast Water Treatment Market by Technology (Physical Disinfection, Mechanical Method, Chemical Method), Capacity, Service, Ship Type (Container Ships, Dry Bulk Carriers, Tankers, General Cargos) and Geography — Global Forecast to 2022”, the market is expected to be worth USD 118.77 Billion by 2022, growing at a CAGR of 37.19% between 2017 and 2022. The driving factors for the growth of this market include rise in volumes of seaborne trade and increasing government initiatives toward marine environmental protection.

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Browse 79 market tables and 53 figures spread through 157 pages on “Ballast Water Treatment Market — Global Forecast to 2022”
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Container ships accounted for the largest size of the ballast water treatment market in 2016

Container ships are a common means of commercial transport and are widely used to carry non-bulk cargo. They can be used to carry a wide variety of goods, such as commodities (coal, wheat), manufactured goods, cars, and refrigerated (perishable) goods. The growth of this segment is mainly attributed to the rising trade volumes in the APAC region. The number of containers handled at ports in APAC has increased drastically over the years. It is primarily due to the Asian economies such as China, Singapore, Hong Kong, Japan, and South Korea, which have become world’s manufacturing powerhouses.

Physical disinfection expected to dominate the ballast water treatment market during the forecast period

Physical disinfection is expected to lead the overall market during the forecast period. This method is used globally to treat ballast water, and it is most effective against a broad range of organisms. Physical disinfection also offers considerable advantages such as ease of operation and high level of efficiency.

The ballast water treatment market in APAC expected to grow at the highest rate during the forecast period

APAC is expected to hold the largest share of the ballast water treatment market by 2022. APAC comprises developing as well as various developed economies such as Japan, China, South Korea, and Singapore, which have a huge potential for ballast water treatment systems. Some of the major drivers for the growing demand for ballast water treatment systems in APAC include the rising adoption of IMO regulations and increasing trade of chemicals and other goods within this region.

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Major players in this industry include Wärtsilä Corporation (Finland), Xylem Inc. (U.S.), Evoqua Water Technologies LLC (U.S.), Calgon Carbon Corporation (U.S.), Ecochlor, Inc. (U.S.), Veolia Environnement S.A. (France), Alfa Laval AB (Sweden), Trojan Marinex (Canada), Mitsubishi Heavy Industries, Ltd. (Japan), atg UV Technology (U.K.), Qingdao Headway Technology Co., Ltd. (China), JFE Engineering Corporation (Japan), and Optimarin AS (Norway).

Structured Cabling Market worth $13.13 Billion by 2020

According to a new market research report "Structured Cabling Market by Solution Type (Products, Services and Software), Vertical (IT & Telecommunication, Residential & Commercial, Government & Education, Transportation, Industrial and Others) and geography - Global forecast to 2020", the global structured cabling market was valued at $7.72 Billion in 2014 and is expected to reach up to $13.13 Billion by 2020, at a CAGR of 9.0% between 2015 and 2020.

• Download Informational PDF Brochure :-
http://www.marketsandmarkets.com/pdfdownload.asp?id=199394143

Browse 69 tables and 92 figures spread through 179 Pages and in-depth TOC on "Structured Cabling Market - Global forecast to 2020"
http://www.marketsandmarkets.com/Market-Reports/structured-cabling-market-199394143.html
Early buyers will receive 10% customization on reports.

Structured cabling system can be defined as a set of cables & connectivity products that are used for the integration of various management systems to enable the transmission of voice, data, and video signals. The structured cabling market has faced its highs and lows, however has managed to register a healthy growth rate. This market is expected to witness moderate growth during the forecast period. The demand for high-speed connectivity devices & systems, trend of data center convergence, and expansion of the communication infrastructure are some of the primary factors that are contributing to the growth of this market. The extensive growth of LED lighting systems market, transition from analog to IP-based video surveillance systems, and increasing usage of FTTH/FTTP are expected to drive the market in the future.

This report provides a detailed analysis of the overall structured cabling market and segments the same based on component, application, vertical, and geography.

The objective of the research study was to analyze the market trends for each of the industries, the growth rates of the various solution types, and the demand comparison for all industry verticals. The structured cabling market has been segmented based on solution type into products, services, and software which are the crucial components of a structured cabling system which is formed by the integration of various management systems to combine the voice, data, and video signals.

Apart from the market segmentation, the report also covers the Porter’s Five Forces analysis, the market’s value chain with a detailed process flow diagram, and the market dynamics such as the drivers, restraints, and opportunities in the overall structured cabling market.

The major players in the structured cabling market have also been profiled in this report. The company profile section covers the profiles of the top 10 players in this market. It provides information about their business overview along with products & services offered, key strategies and recent developments, and the MnM view for the profiled companies.

This report profiles all the major companies involved in the structured cabling market such as CommScope, Inc. (U.S.), Nexans S.A. (France), Panduit Corp. (U.S.), Legrand (France), Corning, Inc. (U.S.), Belden, Inc. (U.S.), ABB Ltd. (Switzerland), Schneider Electric SE (France), Panduit Corp. (U.S.), and Siemon (U.S.).

About MarketsandMarkets

MarketsandMarkets is world’s No. 2 firm in terms of annually published premium market research reports. Serving 1700 global fortune enterprises with more than 1200 premium studies in a year, M&M is catering to multitude of clients across 8 different industrial verticals. We specialize in consulting assignments and business research across high growth markets, cutting edge technologies and newer applications. Our 850 fulltime analyst and SMEs at MarketsandMarkets are tracking global high growth markets following the "Growth Engagement Model – GEM". The GEM aims at proactive collaboration with the clients to identify new opportunities, identify most important customers, write "Attack, avoid and defend" strategies, identify sources of incremental revenues for both the company and its competitors.

M&M’s flagship competitive intelligence and market research platform, "RT" connects over 200,000 markets and entire value chains for deeper understanding of the unmet insights along with market sizing and forecasts of niche markets. The new included chapters on Methodology and Benchmarking presented with high quality analytical infographics in our reports gives complete visibility of how the numbers have been arrived and defend the accuracy of the numbers.

We at MarketsandMarkets are inspired to help our clients grow by providing apt business insight with our huge market intelligence repository.

Contact:
 

Mr. Rohan
Markets and Markets
UNIT no 802, Tower no. 7, SEZ
Magarpatta city, Hadapsar
Pune, Maharashtra 411013, India
1-888-600-6441
Email: sales@marketsandmarkets.com

System in Package (SiP) Market worth $18.10 Billion by 2020

According to a new market research report "System in Package (SIP) Market by Technology (2D, 2.5D & 3D), by Type (BGA, SMT, QFP, SOP), Interconnection Technology (Flip-Chip & Wire-bond), Applications (Communications, Consumer, Automotive, Medical) and Geography (N. America, Europe, APAC & ROW) Global Trends & Forecasts to - 2014 - 2020" the total System in Package (SiP) market is expected to reach $18.10 billion by 2020, growing at a CAGR of 9.57% from 2013 to 2020.

• Download Informational PDF Brochure :-
http://www.marketsandmarkets.com/pdfdownload.asp?id=625

Browse 76 market data tables, 59 figures spread through 277 pages and in-depth TOC on “System in Package (SIP) Market by Technology (2D, 2.5D & 3D), by Type (BGA, SMT, QFP, SOP), Interconnection Technology (Flip-Chip & Wire-bond), Applications (Communications, Consumer, Automotive, Medical) and Geography (N. America, Europe, APAC & ROW) Global Trends & Forecasts to - 2014 - 2020”

http://www.marketsandmarkets.com/Market-Reports/System-In-Package-SIP-Market-Chip-Stack-Multi-Chip-Module-MCM-Market-625.html

Early buyers will receive 10% customization on reports.

The advance packaging has given a rise to innovative safety systems in automotive and transportation sector which will drive the System in Package (SiP) market; for example, Local Interconnect Network (LIN) solutions within the vehicle for operating the devices was introduced by Atmel Corporation (U.S.). In the overall System in Package (SiP) market, the consumer electronics sector will be the highest revenue generator and lead the market from the demand side. Semiconductor industry has a trend of outsourcing advance packaging and testing services, in which, most of the players are from the Asia-Pacific region.

The concept of System in Package (SiP) came into major attention when increasing demands for
miniaturization and higher functionality at lower cost process was introduced by advance semiconductor packaging industries. As the ICs and the major electrical component were packaged into a single module, this had increased the overall performance, reliability, and efficiency of the module.

The report’s detailed segmentations by technology, packaging type, interconnection technology, applications, and geography cover all the existing and emerging technologies in the System in Package (SiP) market. The major packaging technologies that have been extensively covered in the report are 2D, 2.5D, and 3D IC packaging; the packaging types covered are Ball Grid Array (BGA), Surface Mount Technology (SMT), Quad Flat Package (QFP), and Small Outline Package (SOP); and the interconnection technologies for packaging are flip chip and wire bond technologies.

The application segmentation of the market covers all the major applications like consumer electronics, communication, medical, industrial, automobile and transportation, and military, defense, and aerospace in detail.

One of the objectives of the research study was to analyze the market trends for each of the System in Package (SiP) technologies; and the growth rates of the various packaging type and interconnection technologies.

Apart from market segmentation, the report also includes in depth analysis like the Porter’s five force analysis, value chain with detailed process flow diagram, and market dynamics such as drivers, restraints, and opportunities for the overall System in Package (SiP) market.

About MarketsandMarkets

MarketsandMarkets is a global market research and consulting company based in the U.S. We publish strategically analyzed market research reports and serve as a business intelligence partner to Fortune 500 companies across the world.

MarketsandMarkets also provides multi-client reports, company profiles, databases, and custom research services. M&M covers thirteen industry verticals, including advanced materials, automotives and transportation, banking and financial services, biotechnology, chemicals, consumer goods, energy and power, food and beverages, industrial automation, medical devices, pharmaceuticals, semiconductor and electronics, and telecommunications and IT.

We at MarketsandMarkets are inspired to help our clients grow by providing apt business insight with our huge market intelligence repository.

Contact:

Mr. Rohan
North - Dominion Plaza,
17304 Preston Road,
Suite 800, Dallas, TX 75252
Tel: +1-888-600-6441
Email: sales@marketsandmarkets.com