According to a new market  research report "System in Package (SIP) Market
 by Technology (2D, 2.5D & 3D), by Type (BGA, SMT, QFP, SOP), 
Interconnection Technology (Flip-Chip & Wire-bond), Applications 
(Communications, Consumer, Automotive, Medical) and Geography (N. 
America, Europe, APAC & ROW) Global Trends & Forecasts to -  
2014 - 2020" the total System in Package (SiP) market is 
expected to reach $18.10  billion by 2020, growing at a CAGR of 9.57% 
from 2013 to 2020.
• Download Informational PDF Brochure :-
http://www.marketsandmarkets.com/pdfdownload.asp?id=625
• Download Informational PDF Brochure :-
http://www.marketsandmarkets.com/pdfdownload.asp?id=625
Browse 76 market data tables, 59 
figures spread through 277 pages and in-depth TOC on “System in Package 
(SIP) Market by Technology (2D, 2.5D & 3D), by Type (BGA, SMT, QFP, 
SOP), Interconnection Technology (Flip-Chip & Wire-bond), 
Applications (Communications, Consumer, Automotive, Medical) and 
Geography (N. America, Europe, APAC & ROW) Global Trends & 
Forecasts to - 2014 - 2020”
http://www.marketsandmarkets.com/Market-Reports/System-In-Package-SIP-Market-Chip-Stack-Multi-Chip-Module-MCM-Market-625.html
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http://www.marketsandmarkets.com/Market-Reports/System-In-Package-SIP-Market-Chip-Stack-Multi-Chip-Module-MCM-Market-625.html
Early buyers will receive 10% customization on reports.
The advance packaging has given a rise to innovative 
safety systems in automotive and transportation sector which will drive 
the System in Package (SiP) market; for example, Local Interconnect 
Network (LIN) solutions within the vehicle for operating the devices was
 introduced by Atmel Corporation (U.S.). In the overall System in 
Package (SiP) market, the consumer electronics sector will be the 
highest revenue generator and lead the market from the demand side. 
Semiconductor industry has a trend of outsourcing advance packaging and 
testing services, in which, most of the players are from the 
Asia-Pacific region.
The concept of System in Package (SiP) came into 
major attention when increasing demands for miniaturization and higher 
functionality at lower cost process was introduced by advance 
semiconductor packaging industries. As the ICs and the major electrical 
component were packaged into a single module, this had increased the 
overall performance, reliability, and efficiency of the module.
The report’s detailed segmentations by technology, 
packaging type, interconnection technology, applications, and geography 
cover all the existing and emerging technologies in the System in 
Package (SiP) market. The major packaging technologies that have been 
extensively covered in the report are 2D, 2.5D, and 3D IC packaging; the
 packaging types covered are Ball Grid Array (BGA), Surface Mount 
Technology (SMT), Quad Flat Package (QFP), and Small Outline Package 
(SOP); and the interconnection technologies for packaging are flip chip 
and wire bond technologies.
The application segmentation of the market covers all
 the major applications like consumer electronics, communication, 
medical, industrial, automobile and transportation, and military, 
defense, and aerospace in detail.
One of the objectives of the research study was to 
analyze the market trends for each of the System in Package (SiP) 
technologies; and the growth rates of the various packaging type and 
interconnection technologies.
Apart from market segmentation, the report also 
includes in depth analysis like the Porter’s five force analysis, value 
chain with detailed process flow diagram, and market dynamics such as 
drivers, restraints, and opportunities for the overall System in Package
 (SiP) market.
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Suite 800, Dallas, TX 75252
Tel: +1-888-600-6441
Email: sales@marketsandmarkets.com