According to the new market research report "Hermetic Packaging Market
by Configuration (Multilayer Ceramic, Metal Can, and Pressed Ceramic
Packages), Type (Ceramic–Metal and Glass–Metal Sealing), End-User
Industry (Military & Defense and Aeronautics & Space), Geography
- Global Forecast to 2022", the market is expected to grow
from USD 2.91 Billion in 2016 to USD 4.29 Billion in 2022, at a CAGR of
6.68% during the forecast period.
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Browse 66 market data tables and 62 figures spread through 164 pages and in-depth TOC on “Hermetic Packaging Market - Global Forecast to 2022”
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The need of a packaging method which can protect
highly sensitive electronic components for many years and the growing
demand of hermetically packaged electronic components from the end-user
industries such as automobile electronics and aeronautics & space
are some of the major drivers for the hermetic packaging market.
Multilayer ceramic packages are expected to lead the global hermetic packaging market between 2016 and 2022
Multilayer ceramic packages held a major share of the
hermetic packaging market in 2015. The key factor driving this market
has been the high adoption rate of the multilayer ceramic packages for
high-frequency applications such as data communication, wireless
communication, and optical communication because they provide hermetic
sealing and enable a large number of electrical feedthroughs within very
small spaces.
The market for aeronautics and space industry is expected to grow at the highest rate between 2016 and 2022
There would be a significant rise in the market for
the aeronautics and space industry between 2016 and 2022; the event of
satellite launch known as Matter Particle Explorer in December 2015 has
driven the hermetic packaging market in China for the aeronautics and
space industry. In October 2015, Indian Space Research Organisation
(ISRO) announced a joint venture with National Aeronautics and Space
Administration (NASA) and Japanese Aerospace Exploration Agency (JAXA)
for initiating its own space observatory mission to get a closer look of
the galaxies in outer space. Such significant interest shown by the
Asia-Pacific (APAC) countries such as China and India in space research
is expected to fuel the market for the aeronautics and space industry.
The hermetic packaging market in the APAC region is expected to capture to largest market share during the forecast period
The market in the APAC region is expected to grow at
the highest CAGR between 2016 and 2022. The increasing energy needs
backed by the high GDP growth rate in developing countries such as China
and India is creating opportunities for the manufacturers of
hermetically packaged components in APAC region. Countries such as
China, Japan, and India are now stepping up in space research. The
contribution of these countries in space-related activities such as
satellite launches and space exploration missions is also expected to
drive the hermetic packaging market further.
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The present market is dominated by the players such
as SCHOTT AG (Germany), Teledyne Microelectronics (U.S.), AMETEK, Inc.
(U.S.), Texas Instruments Incorporated (U.S.), and Amkor Technology
(U.S.), among many others.
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